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GaAs Monolithic Integrated Switch O147
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GaAs Monolithic Integrated Switch O140

O140 is a reflective gallium arsenide (PIN) single-pole, double-throw MMIC switch chip with an operating frequency of 10 to 24 GHz. The switch chip can be easily used throughout the operating frequency band. With excellent switching characteristics and port standing wave characteristics over the entire operating frequency range, it is ideally suited for microwave hybrid integrated circuits and multi-chip modules as well as low-power systems. The switch chip adopts on-chip through-hole metallization process to ensure good grounding, no additional grounding measures are needed, and the use is simple and convenient. The backside of the chip is metallized and suitable for eutectic sintering or conductive adhesive bonding processes.
GaAs Monolithic Integrated Switch O147
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GaAs Monolithic Integrated Switch O141

O141 is a reflective GaAs PIN single-pole, double-throw MMIC switch chip with an operating frequency of 6 to 24 GHz. The switch chip provides greater than 45dB isolation and less than 0.8dB insertion loss over the entire operating frequency range. Built-in bias network, easy to use. With excellent switching characteristics and port standing wave characteristics over the entire operating frequency range, it is ideally suited for microwave hybrid integrated circuits and multi-chip modules as well as low-power systems. The switch chip adopts on-chip through-hole metallization process to ensure good grounding, no additional grounding measures are needed, and the use is simple and convenient. The backside of the chip is metallized and suitable for eutectic sintering or conductive adhesive bonding processes.
GaAs Monolithic Integrated Switch O147
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GaAs Monolithic Integrated Switch O142

O142 is a reflective gallium arsenide (PIN) single-pole, single-throw single-throw single-throw MMIC switch chip with an operating frequency of 4 to 26 GHz. The switch chip provides greater than 45dB isolation and less than 0.8dB insertion loss over the entire operating frequency range. Built-in bias network, easy to use. With excellent switching characteristics and port standing wave characteristics over the entire operating frequency range, it is ideally suited for microwave hybrid integrated circuits and multi-chip modules as well as low-power systems. The switch chip adopts on-chip through-hole metallization process to ensure good grounding, no additional grounding measures are needed, and the use is simple and convenient. The backside of the chip is metallized and suitable for eutectic sintering or conductive adhesive bonding processes.
GaAs Monolithic Integrated Switch O147
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GaAs Monolithic Integrated Switch O143

O143 is a reflective gallium arsenide PIN single-pole single-throw single-throw MMIC switch chip with an operating frequency of 0.1 to 30 GHz. The switch chip provides greater than 45dB isolation and less than 0.8dB insertion loss over the entire operating frequency range. With excellent switching characteristics and port standing wave characteristics over the entire operating frequency range, it is ideally suited for microwave hybrid integrated circuits and multi-chip modules as well as low-power systems. The switch chip adopts on-chip through-hole metallization process to ensure good grounding, no additional grounding measures are needed, and the use is simple and convenient. The backside of the chip is metallized and suitable for eutectic sintering or conductive adhesive bonding processes.
GaAs Monolithic Integrated Switch O147
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GaAs Monolithic Integrated Switch O144

O144 is a reflective gallium arsenide (PIN) single-pole, four-throw, four-throw MMIC switch that covers 0.1 to 30 GHz. The switching chip provides greater than 45dB isolation and less than 1.2dB insertion loss over the entire operating frequency range. With excellent switching characteristics and port standing wave characteristics over the entire operating frequency range, it is ideally suited for microwave hybrid integrated circuits and multi-chip modules as well as low-power systems. The switch chip adopts on-chip through-hole metallization process to ensure good grounding, no additional grounding measures are needed, and the use is simple and convenient. The backside of the chip is metallized and suitable for eutectic sintering or conductive adhesive bonding processes.
GaAs Monolithic Integrated Switch O147
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GaAs Monolithic Integrated Switch O145

O145 is a reflective gallium arsenide (PIN) single-pole, three-throw MMIC switch chip with an operating frequency of 2 to 18 GHz. The switch chip provides greater than 30dB isolation and less than 1.2dB insertion loss over the entire operating frequency range. Built-in bias network, easy to use. With excellent switching characteristics and port standing wave characteristics over the entire operating frequency range, it is ideally suited for microwave hybrid integrated circuits and multi-chip modules as well as low-power systems. The switch chip adopts on-chip through-hole metallization process to ensure good grounding, no additional grounding measures are needed, and the use is simple and convenient. The backside of the chip is metallized and suitable for eutectic sintering or conductive adhesive bonding processes.
GaAs Monolithic Integrated Switch O147
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GaAs Monolithic Integrated Switch O147

O147 is a reflective gallium arsenide PIN single pole double throw MMIC switch chip, working frequency covers 2 ~ 20GHz. The switch chip provides greater than 30dB isolation and less than 1.0dB insertion loss over the entire operating frequency range. Built-in bias network, easy to use. With excellent switching characteristics and port standing wave characteristics over the entire operating frequency range, it is ideally suited for microwave hybrid integrated circuits and multi-chip modules as well as low-power systems. The switch chip adopts on-chip through-hole metallization process to ensure good grounding, no additional grounding measures are needed, and the use is simple and convenient. The backside of the chip is metallized and suitable for eutectic sintering or conductive adhesive bonding processes.