ImageSKUInput P-0.1 (dB)Insertion Loss (dB)Isolation (dB)Max. Frequency (GHz)Min. Frequency (GHz)Return Loss RFC(ON)PriceBuyhf:att:pa_input-p-0-1-dbhf:att:pa_insertion-loss-dbhf:att:pa_isolation-dbhf:att:pa_max-frequency-ghzhf:att:pa_min-frequency-ghzhf:att:pa_return-loss-rfcon

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GaAs Monolithic Integrated Switch O147
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GaAs Monolithic Integrated Switch O1003

O1003 is a reflective gallium arsenide pHEMT single pole double throw switch chip, working frequency covers 11 ~ 17GHz. The switching chip can provide less than 1.0dB insertion loss and greater than 40dB isolation across the operating frequency band. Use 0/-5V logic control, no external power supply bias, no power consumption. It is often suitable for microwave hybrid integrated circuits and multi-chip modules as well as low-power systems. The chip uses on-chip via metallization process to ensure a good grounding, no additional grounding measures, easy to use. The backside of the chip is metallized and suitable for eutectic sintering or conductive adhesive bonding processes.
GaAs Monolithic Integrated Switch O147
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GaAs Monolithic Integrated Switch O1017D

O1017D is an Absorption GaAs pHEMT single-pole, double-throw switch chip with operating frequency covering DC~20GHz. The switching chip can provide less than 1.6dB insertion loss over the entire operating frequency range. Use 0/-5V logic control. Ideal for microwave hybrid integrated circuits and multi-chip modules as well as low-power systems. The chip uses on-chip via metallization process to ensure a good grounding, no additional grounding measures, easy to use. The backside of the chip is metallized and suitable for eutectic sintering or conductive adhesive bonding processes.
GaAs Monolithic Integrated Switch O147
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GaAs Monolithic Integrated Switch O110

O110 is an absorption type gallium arsenide pHEMT single-pole single-throw switch chip, working frequency covers DC ~ 20GHz. The switch chip can provide less than 2.0dB insertion loss and greater than 40dB isolation across the operating frequency band. Use 0/-5V logic control, no external power supply bias, no power consumption. It is often Suitable for microwave hybrid integrated circuits and multi-chip modules as well as low-power systems. The chip uses on-chip via metallization process to ensure a good grounding, no additional grounding measures, easy to use. The backside of the chip is metallized and suitable for eutectic sintering or conductive adhesive bonding processes.
GaAs Monolithic Integrated Switch O147
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GaAs Monolithic Integrated Switch O111

O111 is an absorption type gallium arsenide pHEMT single pole double throw switch chip, the working frequency covers DC ~ 6GHz. The switching chip can provide less than 1.5dB insertion loss and greater than 60dB isolation across the operating requency band. Use 0/-5V logic control, no external power supply bias, no power consumption. It is often Suitable for microwave hybrid integrated circuits and multi-chip modules as well as low-power systems. The chip uses on-chip via metallization process to ensure a good grounding, no additional grounding measures, easy to use.The backside of the chip is metallized and suitable for eutectic sintering or conductive adhesive bonding processes.
GaAs Monolithic Integrated Switch O147
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GaAs Monolithic Integrated Switch O112

O112 is a reflective gallium arsenide pHEMT single-pole, double-throw switch chip with an operating frequency of DC to 6 GHz. The switching chip can provide less than 1.1dB insertion loss and greater than 50dB isolation across the operating band. Use 0/-5V logic control, no external power supply bias, no power consumption. It is often suitable for microwave hybrid integrated circuits and multi-chip modules as well as low-power systems. The chip uses on-chip via metallization process to ensure a good grounding, no additional grounding measures, easy to use. The backside of the chip is metallized and suitable for eutectic sintering or conductive adhesive bonding processes.
GaAs Monolithic Integrated Switch O147
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GaAs Monolithic Integrated Switch O113

O113 is an absorption type gallium arsenide pHEMT single pole double throw switch chip, the working frequency covers DC~20GHz. The switch chip can provide less than 2.0dB insertion loss and greater than 45dB isolation across the operating frequency band. Use 0/-5V logic control, no external power supply bias, no power consumption. It is often suitable for microwave hybrid integrated circuits and multi-chip modules as well as low-power systems. The chip uses on-chip via metallization process to ensure a good grounding, no additional grounding measures, easy to use. The backside of the chip is metallized and suitable for eutectic sintering or conductive adhesive bonding processes.
GaAs Monolithic Integrated Switch O147
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GaAs Monolithic Integrated Switch O114

O114 is a reflective gallium arsenide pHEMT single-pole double-throw switch chip, operating frequency covering DC ~ 30GHz. The switch chip can provide less than 2.2dB insertion loss and greater than 26dB isolation across the operating frequency band. Use 0/-5V logic control, no external power supply bias, no power consumption. It is often suitable for microwave hybrid integrated circuits and multi-chip modules as well as low-power systems. The chip uses on-chip via metallization process to ensure a good grounding, no additional grounding measures, easy to use. The backside of the chip is metallized and suitable for eutectic sintering or conductive adhesive bonding processes.
GaAs Monolithic Integrated Switch O147
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GaAs Monolithic Integrated Switch O116

O116 is an absorption type gallium arsenide pHEMT single pole double throw switch chip, working frequency covers 100M~4GHz. The switch chip can provide less than 1.2dB insertion loss and greater than 38dB isolation across the operating frequency band. Using 0/+5V logic control, no external power supply bias, no power consumption. It is often suitable for microwave hybrid integrated circuits and multi-chip modules as well as low-power systems. The chip uses on-chip via metallization process to ensure a good grounding, no additional grounding measures, easy to use. The backside of the chip is metallized and suitable for eutectic sintering or conductive adhesive bonding processes.
GaAs Monolithic Integrated Switch O147
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GaAs Monolithic Integrated Switch O117

O117 is a reflective gallium arsenide pHEMT single pole double throw switch chip, working frequency covers 100M~6GHz. The switching chip can provide less than 0.8dB insertion loss and greater than 30dB isolation across the operating frequency band. Using 0/+5V logic control, no external power supply bias, no power consumption. It is often suitable for microwave hybrid integrated circuits and multi-chip modules as well as low-power systems. The chip uses on-chip via metallization process to ensure a good grounding, no additional grounding measures, easy to use. The backside of the chip is metallized and suitable for eutectic sintering or conductive adhesive bonding processes.
GaAs Monolithic Integrated Switch O147
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GaAs Monolithic Integrated Switch O118

O118 is a reflective gallium arsenide pHEMT single-pole, double-throw switch chip, operating frequency covering DC ~ 12GHz. The switch chip can provide less than 1.0dB insertion loss and greater than 36dB isolation across the operating frequency band. Use 0/-5V logic control, no external power supply bias, no power consumption. It is often suitable for microwave hybrid integrated circuits and multi-chip modules as well as low-power systems. The chip uses on-chip via metallization process to ensure a good grounding, no additional grounding measures, easy to use. The backside of the chip is metallized and suitable for eutectic sintering or conductive adhesive bonding processes.
GaAs Monolithic Integrated Switch O147
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GaAs Monolithic Integrated Switch O119

O119 is a reflective gallium arsenide pHEMT single-pole, double-throw switch chip, operating frequency covering DC ~ 15GHz. The switch chip can provide less than 1.5dB insertion loss and greater than 38dB isolation across the operating frequency band. Use 0/-5V logic control, no external power supply bias, no power consumption. It is often suitable for microwave hybrid integrated circuits and multi-chip modules as well as low-power systems. The chip uses on-chip via metallization process to ensure a good grounding, no additional grounding measures, easy to use. The backside of the chip is metallized and suitable for eutectic sintering or conductive adhesive bonding processes.
GaAs Monolithic Integrated Switch O147
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GaAs Monolithic Integrated Switch O124

O124 is an absorption GaAs pHEMT single-pole, eight-throw switch chip with an operating frequency of DC to 10 GHz. The switch chip provides greater than 50dB isolation and less than 3dB insertion loss over the entire operating frequency range. Built-in 3:8 decoder, using -5V + TTL control. Ideal for microwave hybrid integrated circuits and multi-chip modules as well as low-power systems. The chip uses on-chip via metallization process to ensure a good grounding, no additional grounding measures, easy to use. The backside of the chip is metallized and suitable for eutectic sintering or conductive adhesive bonding processes.
GaAs Monolithic Integrated Switch O147
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GaAs Monolithic Integrated Switch O125

O125 is an absorption GaAs pHEMT single-pole, eight-throw switch chip, operating frequency covering DC ~ 35GHz. The switch chip provides greater than 30dB isolation and less than 3.3dB insertion loss over the entire operating frequency range. Built-in 2:4 decoder, using -5V + TTL control. Ideal for microwave hybrid integrated circuits and multi-chip modules as well as low-power systems. The chip uses on-chip via metallization process to ensure a good grounding, no additional grounding measures, easy to use. The backside of the chip is metallized and suitable for eutectic sintering or conductive adhesive bonding processes.
GaAs Monolithic Integrated Switch O147
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GaAs Monolithic Integrated Switch O127

O127 is an absorption type gallium arsenide pHEMT single pole double throw switch chip, the working frequency covers DC ~ 15GHz. The switch chip can provide less than 2.5dB insertion loss and greater than 55dB isolation across the entire operating band. Use 0/-5V logic control, no external power supply bias, no power consumption. It is often suitable for microwave hybrid integrated circuits and multi-chip modules as well as low-power systems. The chip uses on-chip via metallization process to ensure a good grounding, no additional grounding measures, easy to use. The backside of the chip is metallized and suitable for eutectic sintering or conductive adhesive bonding processes.
GaAs Monolithic Integrated Switch O147
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GaAs Monolithic Integrated Switch O129

O129 is a reflective gallium arsenide pHEMT single-pole double-throw switch chip, operating frequency covering DC ~ 40GHz. The switch chip can provide less than 2.5dB insertion loss and more than 25dB isolation across the operating frequency band. Use 0/-5V logic control, no external power supply bias, no power consumption. It is often suitable for microwave hybrid integrated circuits and multi-chip modules as well as low-power systems. The chip uses on-chip via metallization process to ensure a good grounding, no additional grounding measures, easy to use. The backside of the chip is metallized and suitable for eutectic sintering or conductive adhesive bonding processes.
GaAs Monolithic Integrated Switch O147
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GaAs Monolithic Integrated Switch O133

O133 is a reflective gallium arsenide pHEMT single pole double throw switch chip, working frequency covers 20 ~ 40GHz. The switch chip can provide less than 1.6dB insertion loss and greater than 25dB isolation across the entire operating band. Use 0/-5V logic control, no external power supply bias, no power consumption. It is often suitable for microwave hybrid integrated circuits and multi-chip modules as well as low-power systems. The chip uses on-chip via metallization process to ensure a good grounding, no additional grounding measures, easy to use. The backside of the chip is metallized and suitable for eutectic sintering or conductive adhesive bonding processes.
GaAs Monolithic Integrated Switch O147
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GaAs Monolithic Integrated Switch O140

O140 is a reflective gallium arsenide (PIN) single-pole, double-throw MMIC switch chip with an operating frequency of 10 to 24 GHz. The switch chip can be easily used throughout the operating frequency band. With excellent switching characteristics and port standing wave characteristics over the entire operating frequency range, it is ideally suited for microwave hybrid integrated circuits and multi-chip modules as well as low-power systems. The switch chip adopts on-chip through-hole metallization process to ensure good grounding, no additional grounding measures are needed, and the use is simple and convenient. The backside of the chip is metallized and suitable for eutectic sintering or conductive adhesive bonding processes.
GaAs Monolithic Integrated Switch O147
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GaAs Monolithic Integrated Switch O141

O141 is a reflective GaAs PIN single-pole, double-throw MMIC switch chip with an operating frequency of 6 to 24 GHz. The switch chip provides greater than 45dB isolation and less than 0.8dB insertion loss over the entire operating frequency range. Built-in bias network, easy to use. With excellent switching characteristics and port standing wave characteristics over the entire operating frequency range, it is ideally suited for microwave hybrid integrated circuits and multi-chip modules as well as low-power systems. The switch chip adopts on-chip through-hole metallization process to ensure good grounding, no additional grounding measures are needed, and the use is simple and convenient. The backside of the chip is metallized and suitable for eutectic sintering or conductive adhesive bonding processes.
GaAs Monolithic Integrated Switch O147
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GaAs Monolithic Integrated Switch O142

O142 is a reflective gallium arsenide (PIN) single-pole, single-throw single-throw single-throw MMIC switch chip with an operating frequency of 4 to 26 GHz. The switch chip provides greater than 45dB isolation and less than 0.8dB insertion loss over the entire operating frequency range. Built-in bias network, easy to use. With excellent switching characteristics and port standing wave characteristics over the entire operating frequency range, it is ideally suited for microwave hybrid integrated circuits and multi-chip modules as well as low-power systems. The switch chip adopts on-chip through-hole metallization process to ensure good grounding, no additional grounding measures are needed, and the use is simple and convenient. The backside of the chip is metallized and suitable for eutectic sintering or conductive adhesive bonding processes.
GaAs Monolithic Integrated Switch O147
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GaAs Monolithic Integrated Switch O143

O143 is a reflective gallium arsenide PIN single-pole single-throw single-throw MMIC switch chip with an operating frequency of 0.1 to 30 GHz. The switch chip provides greater than 45dB isolation and less than 0.8dB insertion loss over the entire operating frequency range. With excellent switching characteristics and port standing wave characteristics over the entire operating frequency range, it is ideally suited for microwave hybrid integrated circuits and multi-chip modules as well as low-power systems. The switch chip adopts on-chip through-hole metallization process to ensure good grounding, no additional grounding measures are needed, and the use is simple and convenient. The backside of the chip is metallized and suitable for eutectic sintering or conductive adhesive bonding processes.
GaAs Monolithic Integrated Switch O147
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GaAs Monolithic Integrated Switch O144

O144 is a reflective gallium arsenide (PIN) single-pole, four-throw, four-throw MMIC switch that covers 0.1 to 30 GHz. The switching chip provides greater than 45dB isolation and less than 1.2dB insertion loss over the entire operating frequency range. With excellent switching characteristics and port standing wave characteristics over the entire operating frequency range, it is ideally suited for microwave hybrid integrated circuits and multi-chip modules as well as low-power systems. The switch chip adopts on-chip through-hole metallization process to ensure good grounding, no additional grounding measures are needed, and the use is simple and convenient. The backside of the chip is metallized and suitable for eutectic sintering or conductive adhesive bonding processes.
GaAs Monolithic Integrated Switch O147
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GaAs Monolithic Integrated Switch O145

O145 is a reflective gallium arsenide (PIN) single-pole, three-throw MMIC switch chip with an operating frequency of 2 to 18 GHz. The switch chip provides greater than 30dB isolation and less than 1.2dB insertion loss over the entire operating frequency range. Built-in bias network, easy to use. With excellent switching characteristics and port standing wave characteristics over the entire operating frequency range, it is ideally suited for microwave hybrid integrated circuits and multi-chip modules as well as low-power systems. The switch chip adopts on-chip through-hole metallization process to ensure good grounding, no additional grounding measures are needed, and the use is simple and convenient. The backside of the chip is metallized and suitable for eutectic sintering or conductive adhesive bonding processes.
GaAs Monolithic Integrated Switch O147
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GaAs Monolithic Integrated Switch O147

O147 is a reflective gallium arsenide PIN single pole double throw MMIC switch chip, working frequency covers 2 ~ 20GHz. The switch chip provides greater than 30dB isolation and less than 1.0dB insertion loss over the entire operating frequency range. Built-in bias network, easy to use. With excellent switching characteristics and port standing wave characteristics over the entire operating frequency range, it is ideally suited for microwave hybrid integrated circuits and multi-chip modules as well as low-power systems. The switch chip adopts on-chip through-hole metallization process to ensure good grounding, no additional grounding measures are needed, and the use is simple and convenient. The backside of the chip is metallized and suitable for eutectic sintering or conductive adhesive bonding processes.