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Ferrite Devices OIS-400440-07-18-2224F-S
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Ferrite Devices OIS-400440-07-18-2224F-S

Model OIS-400440-07-18-2224F-S is a Q band Iso-adapter that covers the frequencyrange of40to44GHz.The iso-adapter offers nominal 0.7 dB insertion loss and an18dB typical isolation.The iso-adapter is designed and fabricated to bridge thewaveguide to coax interface directly, yet exhibits the port isolation to improvethe system performance. The input port of the model isWR-22waveguide withstandardUG-383/U flange and 2.4 mm (F) connector as output port.Themodel number with the reversed input and output ports is SNA-4034430718-2F22-S1
GaAs Monolithic Integrated Switch O147
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GaAs Monolithic Integrated Switch O117

O117 is a reflective gallium arsenide pHEMT single pole double throw switch chip, working frequency covers 100M~6GHz. The switching chip can provide less than 0.8dB insertion loss and greater than 30dB isolation across the operating frequency band. Using 0/+5V logic control, no external power supply bias, no power consumption. It is often suitable for microwave hybrid integrated circuits and multi-chip modules as well as low-power systems. The chip uses on-chip via metallization process to ensure a good grounding, no additional grounding measures, easy to use. The backside of the chip is metallized and suitable for eutectic sintering or conductive adhesive bonding processes.
GaAs Monolithic Integrated Switch O147
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GaAs Monolithic Integrated Switch O145

O145 is a reflective gallium arsenide (PIN) single-pole, three-throw MMIC switch chip with an operating frequency of 2 to 18 GHz. The switch chip provides greater than 30dB isolation and less than 1.2dB insertion loss over the entire operating frequency range. Built-in bias network, easy to use. With excellent switching characteristics and port standing wave characteristics over the entire operating frequency range, it is ideally suited for microwave hybrid integrated circuits and multi-chip modules as well as low-power systems. The switch chip adopts on-chip through-hole metallization process to ensure good grounding, no additional grounding measures are needed, and the use is simple and convenient. The backside of the chip is metallized and suitable for eutectic sintering or conductive adhesive bonding processes.