Showing all 6 results

Show sidebar
GaAs Monolithic Integrated 0 Degree Power O510
Close

GaAs Monolithic Integrated 0 Degree Power O1600

The O1600 GaAs monolithic 3-way 0-degree power splitter has low insertion loss and excellent port standing wave characteristics in the frequency range of 6 to 18 GHz. The isolation is greater than 15 dB, and is ideally suited for microwave hybrid integrated circuits and multiple applications. Chip module. The chip uses on-chip via metallization process to ensure a good grounding, no additional grounding measures, easy to use. The backside of the chip is metallized and suitable for eutectic sintering or conductive adhesive bonding processes.
GaAs Monolithic Integrated 0 Degree Power O510
Close

GaAs Monolithic Integrated 0 Degree Power O1649

The O1649 GaAs monolithic 0 degree power splitter has lowinsertion loss, high isolation, and excellent port standing wave characteristics in the frequency range of 6.0 to 18 GHz. The isolation is greater than 17 dB, and the static level is Class 1B. It is very suitable for applications Microwave hybrid integrated circuits and multi-chip modules. The chip uses on-chip via metallization process to ensure a good grounding, no additional grounding measures, easy to use. The backside of the chip is metallized and suitable for eutectic sintering or conductive adhesive bonding processes.
GaAs Monolithic Integrated 0 Degree Power O510
Close

GaAs Monolithic Integrated 0 Degree Power O494

O494 type GaAs monolithic 0 degree power splitter has low insertion loss and excellent port standing wave characteristics in the frequency range of 6~18 GHz. The isolation degree is more than 15dB, which is very suitable for microwave hybrid integrated circuits and multi-chip modules. The chip uses on-chip via metallization process to ensure a good grounding, no additional grounding measures, easy to use. The backside of the chip is metallized and suitable for eutectic sintering or conductive adhesive bonding processes.
GaAs Monolithic Integrated 0 Degree Power O510
Close

GaAs Monolithic Integrated 0 Degree Power O506

O506 type GaAs monolithic 0 degree power splitter has low insertion loss and excellent port standing wave characteristics in the frequency range of 6~18GHz. The isolation degree is more than 17dB, and it is very suitable for microwave hybrid integrated circuits and multi-chip modules. The chip uses on-chip via metallization process to ensure a good grounding, no additional grounding measures, easy to use. The backside of the chip is metallized and suitable for eutectic sintering or conductive adhesive bonding processes.
GaAs Monolithic Integrated 0 Degree Power O510
Close

GaAs Monolithic Integrated 0 Degree Power O508

O508 type GaAs monolithic 4-way zero-degree power divider has low insertion loss and excellent port standing wave characteristics in the frequency range of 6~18GHz, and the isolation is greater than 15dB, which is very suitable for microwave hybrid integrated circuits and many Chip module. The chip uses on-chip via metallization process to ensure a good grounding, no additional grounding measures, easy to use. The backside of the chip is metallized and suitable for eutectic sintering or conductive adhesive bonding processes.
Monolithic Integrated CNC Phase Shifter O339
Close

Monolithic Integrated CNC Phase Shifter O324

The O324 is a GaAs 6-bit digital phase shifter chip. Operating frequency 6 ~ 18GHz, insertion loss is less than 12.5dB, the basic shift phase -5.625 °, -11.25 °, -22.5 °, -45 °, -90 °, -180 °, the total phase-shift amount -354.375 °. The chip uses 0/-5V logic control, no external power supply bias, no power consumption. With excellent phase shift accuracy and port standing wave characteristics over the entire operating frequency range, it is ideally suited for microwave hybrid integrated circuits and multi-chip modules as well as low-power systems. The chip uses on-chip via metallization process to ensure a good grounding, no additional grounding measures, easy to use. The backside of the chip is metallized and suitable for eutectic sintering or conductive adhesive bonding processes.