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无源产品
5G
Integrated Driver Amplifier O228GSM3
The O228GSM3 is a monolithic mid-power amplifier operating at 6-15GHz. It provides 15dB gain, 18dBm P1dB output power, and 20% power-added efficiency at a single-supply 5V supply voltage.
The amplifier uses a 3x3mm surface mount leadless ceramic package for hermetic encapsulation. The pin pad surface is gold plated and suitable for reflow soldering processes.
Integrated Driver Amplifier O228GSM3B
O228GSM3B is a monolithic medium power amplifier operating at 6-18GHz. It provides 15dB gain, 18dBm P1dB output power, and 20% power-added efficiency at a single-supply 5V supply voltage.
The amplifier uses a 3x3mm surface mount leadless ceramic package for hermetic encapsulation. The pin pad surface is gold plated and suitable for reflow soldering processes.
Integrated Driver Amplifier O553SM4M
The O553SM4M is a low noise amplifier operating at 1-6GHz. It provides 20dB gain and 17dBm P1dB output power at 60mA operating current.
The amplifier uses a 4x4mm surface-mount non-leaded ceramic package for hermetic encapsulation. The pin pad surface is gold-plated and suitable for reflow soldering.
Integrated Driver Amplifier O555SM4
The O555SM4 is a driver amplifier that operates from 2 to 5.5 GHz. At a working current of 72mA, it can provide 15dB gain and 17dBm P1dB output power.
The amplifier uses a 4x4mm surface-mount non-leaded ceramic package for hermetic encapsulation and is suitable for reflow solder mounting processes.
Integrated Driver Amplifier O556SM4
The O556SM4 is a driver amplifier that operates from 2 to 6 GHz. It provides 24dB gain and 16dBm P1dB output power at 50A operating current.
The amplifier uses a 4x4mm surface-mount non-leaded ceramic package for hermetic encapsulation and is suitable for reflow solder mounting processes.
Integrated Driver Amplifier O566FN5
The O566FN5 is a driver amplifier that operates from 10 to 15 GHz. Provides 28dB of small signal gain and 14.5dBm of P-1 output power at +5V operating voltage.
The amplifier uses a 5x5mm surface-mount non-leaded ceramic package, hermetically sealed, and is suitable for reflow soldering installations.
Integrated Low Noise Amplifier O278SM5H
The O278SM5H is a low noise amplifier operating from 4 to 8 GHz. At a +5V operating voltage, 22dB of small signal gain, 9dBm of P-1 output power, and a typical noise figure of 1.2dB are available.
The amplifier uses 5x5mm surface-mount non-leaded ceramic package, hermetically sealed package, suitable for reflow soldering installation process.
Integrated Low Noise Amplifier O282SM5H
The O282SM5H is a low noise amplifier operating from 5 to 6 GHz. At a +5V operating voltage, it provides 24dB of small signal gain, 11dBm of P-1 output power, and a typical noise figure of 1.0dB.
Integrated Low Noise Amplifier O301SM5
The O301SM5 is a GaAs integrated low noise amplifier operating from 2 to 20 GHz. At +5V operating voltage, 16dB small signal gain, 2.5dB noise figure, and output third-order intercept point above +19dBm are available.
The amplifier uses a 5x5mm surface mount leadless ceramic package for hermetic encapsulation. The pin pad surface is gold plated and suitable for reflow soldering processes.
Integrated Low Noise Amplifier O301SM7H
The O301SM7H is an integrated low noise amplifier that operates from 2 to 20 GHz. Provides 15dB of small signal gain, 2.0dB noise figure, and higher than +22V at +5V operating voltage
dBm output third-order intercept point.
The amplifier adopts 7x7mm surface-mount non-leaded ceramic package, which can realize gas-tight encapsulation. The surface of the pin pad is processed by gold plating and is suitable for reflow soldering installation process.
Integrated Low Noise Amplifier O303SM5
The O303SM5 is a GaAs integrated low noise amplifier that operates from DC to 20GHz. At +5V operating voltage, 16dB small signal gain, 2.5dB noise figure, and output third-order intercept point above +24dBm are available.
The amplifier uses a 5x5mm surface mount leadless ceramic package for hermetic encapsulation. The pin pad surface is gold plated and suitable for reflow soldering processes.