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Monolithic Integrated CNC Phase Shifter O339
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Monolithic Integrated CNC Phase Shifter O310

The O310 is a GaAs 6-bit digital phase shifter chip. The operating frequency is 2.1~3.2GHz, the insertion loss is less than 12.5dB, and the basic shift phase is -5.625°, -11.25°, -22.5°, -45°, -90°, -180°, and the total phase shift amount is -354.375°. The chip uses 0/-5V logic control, no external power supply bias, no power consumption. With excellent phase shift accuracy and port standing wave characteristics over the entire operating frequency range, it is ideally suited for microwave hybrid integrated circuits and multi-chip modules as well as low-power systems.The chip uses on-chip via metallization process to ensure a good grounding, no additional grounding measures, easy to use. The backside of the chip is metallized and suitable for eutectic sintering or conductive adhesive bonding processes.
Monolithic Integrated CNC Phase Shifter O339
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Monolithic Integrated CNC Phase Shifter O316

The O316 is a GaAs 8-bit digital phase shifter chip. Operating frequency 1.2~1.6GHz, insertion loss less than 5.8dB, basic phase shift -1.4, -2.8, -5.625, -11.25, -22.5, -45, -90, -180, total The phase shift amount is -361.375°. The chip has excellent phase shift accuracy and port standing wave characteristics over the entire operating frequency range and is ideally suited for microwave hybrid integrated circuits and multi-chip modules as well as low-power systems. The chip uses on-chip via metallization process to ensure a good grounding, no additional grounding measures, easy to use. The backside of the chip is metallized and suitable for eutectic sintering or conductive adhesive bonding processes.
Monolithic Integrated CNC Phase Shifter O339
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Monolithic Integrated CNC Phase Shifter O319

The O319 is a GaAs 8-bit digital phase shifter chip. Operating frequency 1.5~1.8GHz, insertion loss less than 5.3dB, basic phase shift -1.4, -2.8, -5.625, -11.25, -22.5, -45, -90, -180, total The phase shift amount is -361.375° The chip has excellent phase shift accuracy and port standing wave characteristics over the entire operating frequency range and is ideally suited for microwave hybrid integrated circuits and multi-chip modules as well as low-power systems. The chip uses on-chip through-hole metallization process to ensure goodGood grounding does not require additional grounding measures and is easy to use. The backside of the chip is metallized and suitable for eutectic sintering or conductive adhesive bonding processes.
Monolithic Integrated CNC Phase Shifter O339
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Monolithic Integrated CNC Phase Shifter O332

The O332 is a GaAs 6-bit digital phase shifter chip. Operating frequency 8-12GHz, insertion loss is less than 8.8dB, basic phase shift is -5.625°, -11.25°, -22.5°, -45°, -90°, -180°, total phase shift amount is -354.375°. The chip uses 0/-5V logic control, no external power supply bias, no power consumption. With excellent phase shift accuracy and port standing wave characteristics over the entire operating frequency range, it is ideally suited for microwave hybrid integrated circuits and multi-chip modules as well as low-power systems. The chip uses on-chip via metallization process to ensure a good grounding, no additional grounding measures, easy to use. The backside of the chip is metallized and suitable for eutectic sintering or conductive adhesive bonding processes.
Monolithic Integrated CNC Phase Shifter O339
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Monolithic Integrated CNC Phase Shifter O332D

The O332D is a GaAs 6-bit digital phase shifter chip. Operating frequency 8-12GHz, insertion loss is less than 8.8dB, basic phase shift is -5.625°, -11.25°, -22.5°, -45°, -90°, -180°, total phase shift amount is -354.375°. The integrated driver inside the chip is easier to use. With excellent phase shift accuracy and port standing wave characteristics over the entire operating frequency range, it is ideally suited for microwave hybrid integrated circuits and multi-chip modules as well as low-power systems. The chip uses on-chip via metallization process to ensure a good grounding, no additional grounding measures, easy to use. The backside of the chip is metallized and suitable for eutectic sintering or conductive adhesive bonding processes.