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5G
Integrated Driver Amplifier O228GSM3
The O228GSM3 is a monolithic mid-power amplifier operating at 6-15GHz. It provides 15dB gain, 18dBm P1dB output power, and 20% power-added efficiency at a single-supply 5V supply voltage.
The amplifier uses a 3x3mm surface mount leadless ceramic package for hermetic encapsulation. The pin pad surface is gold plated and suitable for reflow soldering processes.
Integrated Driver Amplifier O228GSM3B
O228GSM3B is a monolithic medium power amplifier operating at 6-18GHz. It provides 15dB gain, 18dBm P1dB output power, and 20% power-added efficiency at a single-supply 5V supply voltage.
The amplifier uses a 3x3mm surface mount leadless ceramic package for hermetic encapsulation. The pin pad surface is gold plated and suitable for reflow soldering processes.
Integrated Driver Amplifier O553SM4
The O553SM4 is a low noise amplifier operating at 0.8-6.5 GHz. It provides 21dB gain and 17dBm P1dB output power at 65mA operating current.The amplifier uses a 4x4mm surface-mount non-leaded ceramic package for hermetic encapsulation.
The pin pad surface is gold-plated and suitable for reflow soldering.
Integrated Driver Amplifier O553SM84
The O553SM84 is an integrated amplifier operating at 0.8-6.0 GHz. Built-in bias circuit provides 20dB gain and 17dBm P1dB output power at 65mA operating current.
The amplifier adopts 5x7mm surface-mounting cermet shell, fully sealed, and the bottom surface needs to be grounded in a large area. It is suitable for the reflow soldering installation process, and the lead wire must be hand-welded.
Integrated Driver Amplifier O556SM5H
The O556SM5H is a driver amplifier that operates from 2 to 6 GHz. It provides 23dB small signal gain and 15dBm P-1 output power at +5V operating voltage. Noise figure is typically 3dB.
The amplifier uses a 4x4mm surface-mount non-leaded ceramic package for hermetic encapsulation and is suitable for reflow solder mounting processes.
Integrated Driver Amplifier O556SM84
The O556SM84 is an integrated amplifier operating at 2.0-6.0 GHz. Built-in bias circuit provides 24dB gain and 14dBm P1dB output power at 50mA operating current.
The amplifier adopts 5x7mm surface-mounting cermet shell, fully sealed, and the bottom surface needs to be grounded in a large area. It is suitable for the reflow soldering installation process, and the lead wire must be hand-welded.
Integrated Driver Amplifier O568QF4
The O568QF4 is a driver amplifier that operates from 2 to 6 GHz. It can provide 30dB power gain and 30dBm saturated output power under the power supply +28V operating voltage.
The amplifiers are packaged in a metal package and can be hermetically sealed. The surface of the pin pad is gold-plated and suitable for reflow soldering.
Integrated Driver Amplifier O573FN5
The O573FN5 is a driver amplifier that operates from 5 to 20 GHz. At a +5V operating voltage, it provides 21dB of small signal gain, 21dBm of P-1 output power, and an output third-order intercept point of +30dBm.
The amplifier uses a 5x5mm surface-mount non-leaded ceramic package, hermetically sealed, and is suitable for reflow soldering installations.
Integrated Driver Amplifier O574FN5
The O574FN5 is a driver amplifier that operates from 4 to 8 GHz. It provides 21dB small signal gain and 15dBm P-1 output power at +5V operating voltage.
The amplifier uses a 5x5mm surface-mount non-leaded ceramic package, hermetically sealed, and is suitable for reflow soldering installations.
Integrated Low Noise Amplifier O265SM84
The O265SM84 is a low noise amplifier operating at 0.7-4.0 GHz. Built-in bias circuit provides 14.5dB gain, 19dBm P1dB output power, and 2.5dB in-band noise figure at 65mA.
The amplifier adopts 5x7mm surface-mounting cermet shell, fully sealed, and the bottom surface needs large area grounding. It is suitable for the reflow soldering installation process, and the lead wire needs manual welding.
Integrated Low Noise Amplifier O279SM4
The O279SM4 is a low noise amplifier operating at 2-6GHz. Built-in bias circuit provides 24dB gain, 12dBm P1dB output power, and 1.5dB in-band noise figure at 45mA.
The amplifier uses a 4x4mm surface-mount non-leaded ceramic package for hermetic encapsulation. The pin pad surface is gold-plated and suitable for reflow soldering.
Integrated Low Noise Amplifier O279SM5H
The O279SM5H is a low noise amplifier operating from 2 to 6 GHz. With a +5V operating voltage, it provides 25dB of small signal gain, 12dBm of P-1 output power, and a typical noise figure of 1.2dB.
The amplifier uses 5x5mm surface-mount non-leaded ceramic package, hermetically sealed package, suitable for reflow soldering installation process.
Integrated Low Noise Amplifier O283SM7H
The O283SM7H is a low noise amplifier operating from 6 to 18 GHz. With a +5V operating voltage, 27dB small-signal gain, 1.8dB noise figure, and output third-order intercept point above +18dBm are available.
The amplifier adopts 7x7mm surface-mount non-leaded ceramic package, which can realize gas-tight encapsulation. The surface of the pin pad is processed by gold plating and is suitable for reflow soldering installation process.
Integrated Low Noise Amplifier O286SM4
The O286SM4 is a low noise monolithic amplifier operating at 6-13 GHz. The built-in bias circuit can provide 20dB gain, 10dBm P1dB output power and an in-band noise figure of 1.5dB at room temperature under 42mA operating current.
The amplifier uses a 4x4mm surface-mount non-leaded ceramic package for hermetic encapsulation. The pin pad surface is gold-plated and suitable for reflow soldering.
Integrated Low Noise Amplifier O287SM4
The O287SM4 is a low noise amplifier operating at 8-12 GHz. It provides 22dB gain and 13dBm P1dB output power at 55mA operating current.
The amplifier uses a 4x4mm surface-mount non-leaded ceramic package for hermetic encapsulation. The pin pad surface is gold-plated and suitable for reflow soldering.
Integrated Low Noise Amplifier O288SM4
The O288SM4 is a low noise amplifier operating at 8-12 GHz. It provides 30dB gain and 12dBm P1dB output power at 65mA operating current.
The amplifier uses a 4x4mm surface-mount non-leaded ceramic package for hermetic encapsulation. The pin pad surface is gold-plated and suitable for reflow soldering.