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Integrated Switch O121SM4
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Integrated Switch O110DSM4

O110DSM4 is an absorption single-pole single-throw switch, working frequency covers 0.01 ~ 12GHz. The switch provides greater than 50dB isolation and less than 2.8dB insertion loss over the entire operating frequency range. Built-in driver circuit, using 0/+5V logic control. With excellent switching characteristics and port standing wave characteristics over the entire operating frequency range, it is ideally suited for microwave hybrid integrated circuits and multi-chip modules as well as low-power systems. The switch uses a 4x4mm surface-mount non-leaded ceramic package to achieve hermetic encapsulation. The surface of the pin pad is gold-plated and suitable for reflow soldering processes.
Integrated Switch O121SM4
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Integrated Switch O113DSM4M

The O113DSM4M is an absorption single-pole single-throw switch with an operating frequency of DC ~ 12GHz. The switch provides greater than 37dB isolation and less than 2.1dB insertion loss over the entire operating frequency range. Built-in driver circuit, using 0/+5V logic control. With excellent switching characteristics and port standing wave characteristics over the entire operating frequency range, it is ideally suited for microwave hybrid integrated circuits and multi-chip modules as well as low-power systems. The switch uses a 4x4mm surface-mount non-leaded ceramic package to achieve hermetic encapsulation. The surface of the pin pad is gold-plated and suitable for reflow soldering processes.
Integrated Switch O121SM4
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Integrated Switch O113SM3BM

The O113SM3BM is an absorption single-pole single-throw switch with an operating frequency of DC~16GHz. The switch provides greater than 28dB isolation and less than 2.5dB insertion loss over the entire operating frequency range, using 0/-5V logic control. With excellent switching characteristics and port standing wave characteristics over the entire operating frequency range, it is ideally suited for microwave hybrid integrated circuits and multi-chip modules as well as low-power systems. The switch uses a 3x3 mm surface mount leadless ceramic package to achieve hermetic encapsulation. The surface of the pin pad is gold plated and suitable for reflow soldering.